Three Dimensional Transient Cooling of electronic Component in an Enclosure Enhanced by Heat Sink: Part I: Comparison of experimental and Numerical Results

Three Dimensional Transient Cooling of electronic Component in an Enclosure Enhanced by Heat Sink: Part I: Comparison of experimental and Numerical Results

مؤلف البحث
1- H. Hassan, I.S. Taha, N.Y. Abdel Shafey, and A.Y. Turk
مجلة البحث
Journal of Engineering Science
مؤلف البحث
Ibrahim Mohammad Shafie Taha
الناشر
Faculty of Engineering, Assiut University, Egypt
تصنيف البحث
2
عدد البحث
Vol. 30, No. 4
سنة البحث
2002